Electronic Packaging Laboratory

About us

Electronic packaging laboratory of HUST aims at Electronic Packaging, MEMS Packaging, Optoelectronic Packaging and RFID...
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Research

1. Flexible Electronic Packaging
2. MEMS Packaging
3. Electromigration
4. Tin Whisker
5. Solder Paste
6. Anisotropic Conductive Adhesive
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Highlight

In Dec. 8, Prof. Wu give a lecture "Electronic Manufacturing & Electronic Packaging" to the students of Department of Electronic Science & Technology, HUST

Prof. Wu's column in Global SMT& Packaging Detail>>

"Fundamentals of Electronic Manufacture Technology" was published by China Mechanic Industry Press.

News
	Arizona State University/Intel Microelectronics Package Technology Curriculum Development Workshop was held on Nov.29-30.
	The 4th Optics Valley of China International Optoelectronic Exposition and Forum closed with success.
	Prof. Chris Bailey and Dr. Marc Desmulliez revisited our lab.
	We presented in ICEPT'2005.
	Dr. Yong Liu of Fairchild Co. Ltd. visited our lab.
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Notice
	NEPCON 2006 will held on 4th-7th April, Everbright Convention & Exhibition Centre,Shanghai, China.
	The 56th ECTC call for paper.
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Electronic Packaging Laboratory Huazhong Univerisity of Science & Technology