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NEPCON 2006 will held on 4th-7th April, Everbright Convention & Exhibition Centre,Shanghai, China. >>http://www.nepconchina.com/ |
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The 56th Electronic Components and Technology Conference (ECTC) call for paper. >>http://www.ectc.net/ |
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Arizona State University/Intel Microelectronics Package Technology Curriculum Development Workshop was held in National IC Design Industrialization Base (Hangzhou, China) on Nov.29-30. The curriculum workshop program objective is to accelerate the advancement of university Package Technology curriculum in the country through providing an overview of world class' Package Technology curriculum model from Arizona State University. | |
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The 4th Optics Valley of China International Optoelectronic Exposition and Forum opened on 2, Nov, and closed with success on 5, Nov. | |
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Prof. Chris Bailey and Dr. Marc Desmulliez revisited our lab. (2005-09-14) |
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We presented in International Conference on Electronics Packaging Technology (ICEPT) 2005. (2005-08-30) | |
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Dr. Yong Liu of Fairchild Co. Ltd. visited the lab. (2005-07-28) | |
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Prof. Chris Bailey and Dr. Marc Desmulliez visited State Key Laboratory of Plastic Forming Simulation and Die & Mould Technology and Institute of Microsystem. (2005-06-25) | |
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Fundamental of Electronic Manufacture Technology was published by China Mechanic Industry Press. | |
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